Recently, the digital blogger @ digital chat station sent a message suggesting that the main camera of the Redmi K60 series was upgraded to a 50 megapixel big bottom sensor instead of a 100 megapixel one. Netizens speculated that it might be Sony IMX766 or Sony IMX707.
最近，数字博主@数码闲聊站发文暗示，RedmiK60系列主摄像头升级为5000万像素鞋底传感器，而不是1亿像素。网友猜测可能是索尼。IMX766，或者索尼，IMX707。
It is worth noting that on the K40 and K50 series flagship aircraft, Redmi has used 100 million pixels of main camera, and the Samsung HM2 is the most used.
值得注意的是，以前Redmi在K40和K在50系列两代旗舰机上，都有型号使用了1亿像素主摄，使用最多的是三星HM2。
It is reported that the biggest change of HM2 is that the unit pixel size changes from 0.8 μ M reduced to 0.7 μ m。 As a result, the sensor is reduced by 15% (1/1.52 inch) and the height is reduced by 10%, which is more conducive for mobile phone manufacturers to design the layout of internal components, and the size and convexity of external modules can also be reduced.
据悉，HM最大的变化是单位像素尺寸从0不等.8μm缩小为0.7μm。这样，传感器减少了15%(1/1).52英尺)，高度降低10%，更有利于手机厂商做内部部件布置设计，外部模块的大小和凸起水平也可以缓解。
HM2 supports super dual core focusing and 9 pixels in one, which is equivalent to 2.1 μ m. Improve the light input with 12 million pixels, take extreme dark photos, and support 3x lossless zoom.
HM2支持非常双核对焦，支持9像素合一，即等效2.1μm，用1200万像素增加进光量，拍摄极弱光照片，还支持3倍无损变焦等。
This machine will be launched in Q1 next year. Not surprisingly, it will be Redmi's flagship welding operator in 2023.
机器将在明年Q1出现，不出意外，这将是，Redmi2023年旗舰焊门员。